University of California researchers have developed a unique design concept for enhancing the robustness of NTT-based devices, wherein the NTT is grown in specifically-defined regions within the bulk of a substrate, rather than atop it.
Advantages
This simple, but novel design concept provides numerous advantages over current technology:
Reduced potential for delamination of the NTT film, due to mechanical interlocking within the substrate
Reduced potential for cracking of the NTT film, due to reduced strain
Enhanced protection against contact-induced damage, due to location of the NTT film beneath the substrate surface plane
Increased pressure drop across the NTT film, due to reduced potential for cracking and delamination

Figure 1. Schematic illustrations NTT-based flow-through membrane devices:
A) Prior art; and
B) Current invention.
A) Prior art; and
B) Current invention.
Patent Status
Patent Pending
Tech ID: 22871 / UC Case 2012-553-1
